The development prospect of metal surface chemical platingLeixinda Electronics (Shenzhen) Co.,Ltd.Chemical plating is under no external current state of the plating liquid reducing agent will be metal ions reduced to metal and deposited on the surface of parts forming process of metal coating.
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Immersion Process: This chemical process uses a chemical displacement reaction to deposit a layer of a second metal onto a base metal surface. In this reaction, the base metal dissolves, releasing the electrons that reduce the positively charged ions of the second metal present in solution.
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The key point should be treated with hydrogen peroxide first, then heated(not heating the plating liquid first), and then added with any activated carbide. When there are many organic impurities, potassium permanganate is used for treatment.
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